iindaba

1. Imfuno Ebalulekileyo evela kwiiSeva ze-AI kunye neeZiko zeDatha

Iiseva ze-AI zimele umthombo omkhulu wemfuno ekhulayo yeilaphu lefayibha yeglasi ene-dielectric ephantsi. Iinkqubo zoqeqesho lwe-AI kunye nokuqonda zixhomekeke kutshintshiselwano olukhulu lwedatha, nto leyo ebangela ukusetyenziswa kwee-PCB ezibalwe kakhulu kunye neetekhnoloji zonxibelelwano olukhawulezayo; oku kubeka iimfuno ezigqithisileyo kwiipropati ze-dielectric kunye nokuzinza kobukhulu bezinto. Ngokwamkelwa kweteknoloji ezifana nee-PCIe 6.0 kunye nee-224G optical modules, iimfuno zokusebenza ze-copper-clad laminates (CCL) kwiiseva ze-AI zitshintshile ukusuka kwi-standard low-loss ukuya kwi-ultra-low-loss (ULL) kunye ne-hyper-low-loss (HLL), nto leyo eqhuba ngokuthe ngqo ukunyuka kwemfuno yeeklasi ezifanelekileyo zelaphu lefayibha yeglasi eliphantsi le-dielectric. Idatha yemarike ibonisa ukuba ixabiso le-CCL kwiiseva ze-AI liphindwe ka-5 ukuya ku-8 kuneeseva zemveli. Njengezinto ezisisiseko, ilaphu lefayibha yeglasi eliphantsi le-dielectric libone ixabiso lalo lifikelela kwi-320,000–350,000 RMB/ton ngo-2025—ukunyuka kwama-20% ukusukela ekuqaleni konyaka—kunye neemodeli ezithile ezijongene nokunyuka kwamaxabiso okuya kuthi ga kwi-250%–300%.

Ngokuphathelele umsantsa wemfuno yokubonelela ngeenkonzo, oqhutywa kukunyuka rhoqo kwemfuno evela kubathengi be-AI abasezantsi kunye nemida kumandla okuvelisa amalaphu e-elektroniki aphezulu, amanqanaba okhuseleko lwesitokhwe selaphu le-elektroniki eliphezulu kubavelisi abakhulu be-CCL ehle ukuya ngaphantsi kweveki enye yokubonelela ngeenkonzo, nto leyo ebonisa ukuba iphantsi kakhulu kwimbali. Ukuze kuhlangatyezwane nemfuno yeemveliso eziphezulu, abavelisi be-CCL banyanzelekile ukuba banyuse amaxabiso okuthenga. Ngenxa yeendlela zangoku zamaxabiso kunye nemeko yemfuno yokubonelela ngeenkonzo, ilaphu le-fiber yeglasi ephezulu likulungele ukubona ukunyuka ngaxeshanye kumthamo nakwixabiso.

2. Iimfuneko zokusebenza zePakethe yeeChip eziPhezulu

Itekhnoloji yokupakisha ephucukileyo yeetships ze-AI imele enye imeko ebalulekileyo yesicelo seilaphu lefayibha yeglasi ene-dielectric ephantsiNjengoko iinkqubo zokwenziwa kweetshiphusi zisiya kwi-node ye-3nm nangaphezulu, uxinano lweepakeji luyaqhubeka nokunyuka. Ii-substrates ze-ABF—izithwali ezibalulekileyo ezidibanisa iitshiphusi kwi-PCBs—zibeka iimfuno ezingqongqo kakhulu kwiimpawu ze-dielectric kunye nobunyulu bezinto zazo ezisisiseko. Ngokwesiqhelo, i-dielectric constant kufuneka iwele ngaphakathi koluhlu lwe-3.0–4.0 (kwi-1 MHz), kuxhomekeke kwi-frequency yokusebenza, ngelixa i-dissipation factor (Df) kufuneka ilawulwe phakathi kwe-0.005 kunye ne-0.010 (kwi-1 MHz); usetyenziso lwee-frequency eziphezulu (ezifana ne-5G kunye nonxibelelwano olukhawulezayo) zinokufuna amaxabiso aphantsi nangakumbi (<0.005). Ngaphezu koko, ukuhlangabezana neemfuno zokupakisha ezinoxinano oluphezulu, izixhobo kufuneka zilinganise i-Coefficient of Thermal Expansion (CTE) ephantsi kunye nokumelana nobushushu obuphezulu ukuthintela ukwaphuka kwesekethe okubangelwa luxinzelelo lobushushu. Ilaphu lefayibha yeQuartz (ekwaziwa ngokuba yi-“Q-fabric” okanye “ilaphu le-elektroniki lesizukulwana sesithathu”) liye lavela njengezinto ezikhethwayo kwi-ABF substrates ngenxa ye-dielectric constant yayo ephantsi (2.2–2.3), ilahleko encinci ye-dielectric (Df ye-0.001–0.0005), kunye nokukwazi ukumelana namaqondo obushushu okusebenza ixesha elide angama-600°C nangaphezulu.

Ukukhula ngokukhawuleza kokuthunyelwa kweetshiphusi ze-AI kwihlabathi liphela kuqhuba ngokuthe ngqo ukwanda kwemfuno yelaphu le-quartz. Ngokwezibikezelo ze-Future Think Tank, imakethi yelaphu le-quartz kwihlabathi jikelele kulindeleke ukuba ifikelele kwi-$3.127 yeebhiliyoni ngo-2031, ngesantya sokukhula sonyaka esihlanganisiweyo (CAGR) se-23.30%. Olu qikelelo lugxininisa ukunyuka kwemfuno, okuxhomekeke ekunyukeni okuqhubekayo kokuthunyelwa kweetshiphusi ze-AI kunye nokwamkelwa ngokubanzi kobuchwepheshe bokupakisha obuphambili. Ngaphezu koko, uphuhliso lweeplatifomu ze-AI zesizukulwana esilandelayo—ezifana ne-“Rubin”—zihambelana neenkqubo zokuvelisa iitshiphusi ze-3nm okanye ze-N4 kwaye zisebenzisa ukupakisha kwe-substrate enkulu kakhulu ye-CoWoS-L. Ezi platifomu zidibanisa ii-stacks ezisibhozo ze-HBM4 ukuhlangabezana neemfuno ze-bandwidth ephezulu kunye nokunxibelelana, zibonelela ngesisombululo esifanelekileyo sokwandisa amandla ekhompyutha. Iimfuno ze-substrates ezinkulu kakhulu kunye nokusebenza okugqithisileyo ziya kwandisa ngakumbi imfuno yezinto ezikrwada zelaphu le-quartz, ziqhuba ukuvela kweelaphu zeglasi ze-Low-Dk (ezincinci ze-dielectric constant) ukuya kwii-constants ze-dielectric ezisezantsi kunye neempawu zokulahleka okuphantsi.

3. Imiphumo Yokukhula Okudibeneyo Kumacandelo Aliqela

Ngaphaya kwecandelo eliphambili lamandla ekhompyutha ye-AI, imfuno evela kwiindawo ezifana nonxibelelwano lwe-5G/6G kunye ne-elektroniki yabathengi ephezulu iqhuba ukukhula okusebenzisanayo kunye ne-AI. Utshintsho oluvela kwi-5G millimeter-wave (24–100 GHz) ukuya kwi-6G terahertz technology (uluhlu lwemvamisa malunga ne-100 GHz–3 THz) lubandakanya amaza aphezulu enza izixhobo zonxibelelwano zibe buthathaka kakhulu ekulahlekelweni kwesignali. Ngelixa ixesha le-5G lalifuna ilaphu le-fiberglass eliphantsi kakhulu, ixesha le-6G libeka iimfuno ezingqongqo ngakumbi ze-dielectric constant (Dk) kunye ne-dissipation factor (Df): I-Dk kufuneka yehle iye kwi-2.0–3.0 (kwi->100 GHz), kwaye i-Df kufuneka yehle ukusuka kwi-5G standard ye-0.003–0.005 (kwi-10 GHz) ukuya kwi-0.0001–0.0007 (kwi-100 GHz), okudala isidingo selaphu le-quartz "eliphantsi kakhulu". Kwicandelo le-elektroniki yabathengi, i-iPhone 17 isebenzise ilaphu eliphantsi le-CTE (i-coefficient of thermal expansion) kunye nelaphu eliphantsi le-dielectric elibonelelwa yiHonghe Technology ukujongana nemingeni efana nokudibanisa i-chip ye-A10 Pro 3nm, ukuthintela ukugoba kwiibhodi zomama ezinoxinano oluphezulu, kunye nokunciphisa ukulahleka kwamandla kwiimpawu ze-5G/Wi-Fi 7 ezikhawulezayo. Olu tshintsho lubonisa utshintsho olukhawulezileyo lwelaphu le-elektroniki eliphezulu ukusuka kwizicelo zoshishino ukuya kwi-elektroniki yabathengi eqhelekileyo, okuqhuba ukunyuka kwemfuno yezinto ezibonakalayo kunye nokwandisa amaxesha okukhokela ukuhanjiswa. Ukuphuculwa okukrelekrele kwe-elektroniki yeemoto nako kunegalelo ekwandeni kwemfuno; ukuqhuba okuzimeleyo okuphambili (Inqanaba lesi-3 nangaphezulu) kufuna ii-sensors ezininzi ze-ADAS kunye neeradar ezikhawulezayo. Ezi nkqubo zifuna uzinzo lokudluliselwa kwesignali, ukuthembeka kwejoyinti ye-solder yexesha elide, kunye nokuqina kwe-automotive-grade ngokuchasene nokungcangcazela, ubushushu, kunye nokufuma. Ngenxa yoko, izixhobo zebhodi yesekethe ezine-dielectric constants ephantsi, ukulahleka kwe-dielectric ephantsi, ukumelana ne-CAF (conductive anodic filament), kunye ne-CTE ephantsi ziye zaba lukhetho olukhethwayo kwiinkqubo zokuqhuba ezikrelekrele eziphucukileyo, okukhawulezisa ngakumbi ukwamkelwa ngokubanzi kwelaphu le-fiberglass ephezulu. Uqikelelo lweshishini lubonisa ukuba imakethi yehlabathi yelaphu le-elektroniki elingasebenzisi umbane kakhulu ingafikelela kwi-3.76 yeebhiliyoni zeerandi ngo-2031, ikhula ngesantya sonyaka esidibeneyo se-10.1%—umkhwa oqhutywa ikakhulu kukudibana kwemfuno kumacandelo amaninzi.

Umda wokugqibela wokwandisa amandla ekhompyutha usekuphuleni imida ebonakalayo yezinto eziphathekayo. Ukususela kwii-PCB ezilahlekelwa kakhulu ezisetyenziswa kwiiseva ze-AI kunye nelaphu le-quartz kwiipakethe eziphambili ukuya kwii-laminates eziphezulu ze-elektroniki zabathengi kunye nokuqhuba ngokuzimela, ilaphu le-fiberglass eline-dielectric ephantsi lingena "kwixesha elingakaze libonwe ngaphambili." Phakathi kwemfuno yokubonelela ebonakaliswa kukunyuka kwamaxabiso, ukunyuka kwamaxabiso, kunye nokunqongophala kwamandla, eli "laphu le-elektroniki" elibonakala lilula ngokungathandabuzekiyo livele njengelinye lamacandelo okukhula okukhawulezayo ahlanganisa iziseko zehadiwe ze-AI kunye nobuchwepheshe bonxibelelwano obuphezulu besizukulwana esilandelayo.